Patent Assignment
Reel/Frame 050823/0426
Assignment of Assignor's Interest
Recorded: 2019-10-25
Pages: 7
Assignors
CHEN, PING-TZU
Executed: 2019-10-16
LIN, HSING-CHIH
Executed: 2019-10-16
KAO, MIN-FENG
Executed: 2019-10-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Backside Contact for Thermal Displacement in a Multi-Wafer Stacked Integrated Circuit