Patent Assignment
Reel/Frame 050825/0874
Assignment of Assignor's Interest
Recorded: 2019-10-25
Pages: 2
Assignor
HUANG, TSE-YAO
Executed: 2019-09-20
Assignee
NANYA TECHNOLOGY CORPORATION
NO.98, NANLIN RD., TAISHAN DIST.,, NEW TAIPEI CITY, 243, TAIWAN
Covered Property
(1)
Semiconductor Device with Spacer Over Sidewall of Bonding Pad and Method for Preparing the Same