Patent Assignment
Reel/Frame 050854/0671
Assignment of Assignor's Interest
Recorded: 2019-10-29
Pages: 3
Assignors
LEE, HYEWON
Executed: 2019-10-28
YOON, KANGJIN
Executed: 2019-10-28
LEE, DUCKEY
Executed: 2019-10-28
KOO, JONGHOE
Executed: 2019-10-28
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Method and Apparatus for Managing Bundles of Smart Secure Platform