Patent Assignment
Reel/Frame 050857/0692
Assignment of Assignor's Interest
Recorded: 2019-10-30
Pages: 4
Assignors
HUANG, YING-JUI
Executed: 2019-10-08
HSIEH, CHING-HUA
Executed: 2019-10-08
HWANG, CHIEN-LING
Executed: 2019-10-08
HUANG, CHIA-SHENG
Executed: 2019-10-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method and Apparatus for Bonding Semiconductor Substrate