Patent Assignment
Reel/Frame 050885/0598
Assignment of Assignor's Interest
Recorded: 2019-10-31
Pages: 10
Assignors
ELSHERBINI, ADEL
Executed: 2019-09-20
SWAN, JOHANNA
Executed: 2019-09-20
LIFF, SHAWNA
Executed: 2019-09-20
MORROW, PATRICK
Executed: 2019-10-31
PASDAST, GERALD
Executed: 2019-09-22
LE, VAN
Executed: 2019-09-24
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Composite Ic Chips Including a Chiplet Embedded Within Metallization Layers of a Host Ic Chip