Patent Assignment
Reel/Frame 050885/0756
Assignment of Assignor's Interest
Recorded: 2019-10-30
Pages: 3
Assignors
CHOI, BOK KYU
Executed: 2019-10-22
KIM, JONG HOON
Executed: 2019-10-22
KIM, KI BUM
Executed: 2019-10-22
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Stacked Semiconductor Package Having Heat Dissipation Structure