Patent Assignment
Reel/Frame 050887/0088
Assignment of Assignor's Interest
Recorded: 2019-11-01
Pages: 6
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Bump Structure to Prevent Metal Redeposit and to Prevent Bond Pad Consumption and Corrosion