Patent Assignment
Reel/Frame 050893/0191
Assignment of Assignor's Interest
Recorded: 2019-11-01
Pages: 4
Assignors
YU, CHEN-HUA
Executed: 2019-10-07
SU, AN-JHIH
Executed: 2019-10-15
WU, CHI-HSI
Executed: 2019-10-15
YEH, DER-CHYANG
Executed: 2019-10-07
YEH, MING SHIH
Executed: 2019-10-07
LIN, TSUNG-SHU
Executed: 2019-10-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package with Bridge Die For Interconnection and Method Forming Same