Patent Assignment
Reel/Frame 050903/0376
Assignment of Assignor's Interest
Recorded: 2019-11-04
Pages: 8
Assignors
LIN, HUNG-HUA
Executed: 2019-10-15
HUNG, CHIA-MING
Executed: 2019-10-16
HUANG, XIN-HUA
Executed: 2019-10-15
HSIEH, YUAN-CHIH
Executed: 2019-10-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Conductive Bond Structure to Increase Membrane Sensitivty in Mems Device