Patent Assignment
Reel/Frame 050907/0572
Assignment of Assignor's Interest
Recorded: 2019-11-04
Pages: 14
Assignors
HWANG, SEUNG-TAE
Executed: 2019-09-23
KIM, JAE-CHOON
Executed: 2019-10-17
OH, KYUNG-SUK
Executed: 2019-09-30
KIM, WOON-BAE
Executed: 2019-09-25
JUNG, JAE-MIN
Executed: 2019-09-25
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO,, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Chip on Film Package and Display Device Including the Same