Patent Assignment
Reel/Frame 050910/0206
Assignment of Assignor's Interest
Recorded: 2019-11-04
Pages: 5
Assignors
LU, MEI-JU
Executed: 2019-10-29
CHEN, CHI-HAN
Executed: 2019-10-29
LIN, CHANG-YU
Executed: 2019-10-29
LIN, JR-WEI
Executed: 2019-10-29
HUNG, CHIH-PIN
Executed: 2019-10-29
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Electronic Device Package and Method for Manufacturing the Same