Patent Assignment
Reel/Frame 050917/0060
Assignment of Assignor's Interest
Recorded: 2019-11-05
Pages: 3
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129 SAMSUNG-RO, YEONGTONG-GU, SUWON-SI,, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Electronic Device Comprising Heat Dissipation Structure