Patent Assignment
Reel/Frame 050921/0696
Assignment of Assignor's Interest
Recorded: 2019-11-05
Pages: 4
Assignors
TSAI, YAN-MING
Executed: 2019-10-23
CHANG, CHIH-WEI
Executed: 2019-10-23
TSAI, MING-HSING
Executed: 2019-10-23
LIN, SHENG-HSUAN
Executed: 2019-10-23
CHEN, HUNG-HSU
Executed: 2019-10-23
LOH, WEI-YIP
Executed: 2019-10-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Contact Structure for Semiconductor Device and Method