Patent Assignment
Reel/Frame 050934/0897
Assignment of Assignor's Interest
Recorded: 2019-11-06
Pages: 5
Assignor
SEKIMOTO, EIICHI
Executed: 2019-10-18
Assignee
TOKYO ELECTRON LIMITED
AKASAKA BIZ TOWER, 3-1 AKASAKA 5-CHOME MINATO-KU,, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Substrate Processing Apparatus and Substrate Processing Method