Patent Assignment
Reel/Frame 050939/0152
Assignment of Assignor's Interest
Recorded: 2019-11-06
Pages: 3
Assignor
FANG, HSU-NAN
Executed: 2019-11-05
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Package Structure, Assembly Structure and Method for Manufacturing the Same