Patent Assignment
Reel/Frame 050945/0183
Assignment of Assignor's Interest
Recorded: 2019-11-07
Pages: 4
Assignor
LEE, SEOKHYUN
Executed: 2019-08-30
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Redistribution Substrate, Method of Manufacturing the Same, and Semiconductor Package Including the Same