Patent Assignment
Reel/Frame 050946/0369
Assignment of Assignor's Interest
Recorded: 2019-11-07
Pages: 4
Assignors
TING, HENG-WEN
Executed: 2019-10-29
CHEN, KEI-WEI
Executed: 2019-10-30
LI, CHII-HORNG
Executed: 2019-10-30
JENG, PEI-REN
Executed: 2019-10-29
SUNG, HSUEH-CHANG
Executed: 2019-10-29
LEE, YEN-RU
Executed: 2019-10-29
LIN, CHUN-AN
Executed: 2019-10-31
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device and Method of Manufacture