Patent Assignment
Reel/Frame 050948/0141
Assignment of Assignor's Interest
Recorded: 2019-11-07
Pages: 2
Assignors
LEE, PEI-HSUAN
Executed: 2019-10-21
CHI, CHIH-CHIEN
Executed: 2019-10-21
LIU, YU-YING
Executed: 2019-10-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method of Forming an Interconnect in a Semiconductor Device