IP Library › Assignment 050960/0393
Patent Assignment
Reel/Frame 050960/0393

Assignment of Assignor's Interest

Recorded: 2019-11-08 Pages: 5
Assignors
CHEN, CHUN-YUAN
Executed: 2019-09-03
CHIU, SHIH-CHUAN
Executed: 2019-09-03
YOU, JIA-CHUAN
Executed: 2019-09-03
CHANG, CHIA-HAO
Executed: 2019-09-03
LIN, TIEN-LU
Executed: 2019-09-03
LIU, YU-MING
Executed: 2019-09-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Contact Resistance Between Via and Conductive Line
Application: 16/573,719 →
Publication: US 2021/0082742
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 2, 2020
From: CHEN, CHUN-YUAN; CHIU, SHIH-CHUAN; YOU, JIA-CHUAN; CHANG, CHIA-HAO
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 052296/0200 →