Patent Assignment
Reel/Frame 050960/0748
Assignment of Assignor's Interest
Recorded: 2019-11-08
Pages: 4
Assignors
HUANG, CHIH-FAN
Executed: 2019-10-14
WANG, MAO-NAN
Executed: 2019-10-14
CHEN, HUI-CHI
Executed: 2019-10-14
CHEN, DIAN-HAU
Executed: 2019-10-14
CHEN, YEN-MING
Executed: 2019-10-14
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Chip Structure and Method for Forming the Same