Patent Assignment
Reel/Frame 050961/0333
Assignment of Assignor's Interest
Recorded: 2019-11-08
Pages: 7
Assignors
CHO, SU-IL
Executed: 2019-05-28
RYU, SUNG-YOON
Executed: 2019-05-28
YANG, YU-SIN
Executed: 2019-05-28
LEE, CHI-HOON
Executed: 2019-05-28
KWAK, HYUN-SU
Executed: 2019-08-05
KIM, JUNG-WON
Executed: 2019-08-05
Assignees
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
291, DAEHAK-RO, YUSEONG-GU, DAEJEON, 34141, KOREA, REPUBLIC OF
Covered Property
(1)
Thickness Prediction Network Learning Method, Semiconductor Device Manufacturing Method, and Semiconductor Material Deposition Equipment