Patent Assignment
Reel/Frame 050962/0380
Assignment of Assignor's Interest
Recorded: 2019-11-08
Pages: 3
Assignors
KAO, WAN-YI
Executed: 2019-10-27
KO, CHUNG-CHI
Executed: 2019-10-27
LI, WEI-JIN
Executed: 2019-10-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING , CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method for Forming Isolation Structure Having Improved Gap-Fill Capability