Patent Assignment
Reel/Frame 050964/0812
Assignment of Assignor's Interest
Recorded: 2019-11-11
Pages: 10
Assignors
TSAI, PEI-CHUN
Executed: 2019-11-06
HSU, HUNG-HSIN
Executed: 2019-11-06
CHANG CHIEN, SHANG-YU
Executed: 2019-11-06
LIN, NAN-CHUN
Executed: 2019-11-06
Assignee
POWERTECH TECHNOLOGY INC.
NO.10, DATONG RD., HSINCHU INDUSTRIAL PARK, HUKOU TOWNSHIP, HSINCHU COUNTY, TAIWAN
Covered Property
(1)
Chip Package Structure Using Silicon Interposer as Interconnection Bridge