Patent Assignment
Reel/Frame 050966/0195
Assignment of Assignor's Interest
Recorded: 2019-11-11
Pages: 7
Assignors
FUJIWARA, TOSHIA
Executed: 2017-05-23
BRÜGGMANN, HORST
Executed: 2017-05-23
HEROLD, ROLAND
Executed: 2017-05-17
SCHIWON, THOMAS
Executed: 2017-05-18
Assignee
ATOTECH DEUTSCHLAND GMBH
ERASMUSSTRASSE 20, BERLIN, 10553, GERMANY
Covered Property
(1)
Method and Apparatus for Electroplating a Metal Onto a Substrate
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Mar 18, 2021
From: ATOTECH DEUTSCHLAND GMBH; ATOTECH USA, LLC
To: GOLDMAN SACHS BANK USA, AS COLLATERAL AGENT
Reel/Frame 055650/0093 →
Release of Security Interest
Aug 18, 2022
From: GOLDMAN SACHS BANK USA, AS COLLATERAL AGENT
To: ATOTECH DEUTSCHLAND GMBH & CO. KG (F/K/A ATOTECH DEUTSCHLAND GMBH); ATOTECH USA, LLC
Reel/Frame 061521/0103 →