Patent Assignment
Reel/Frame 050969/0458
Assignment of Assignor's Interest
Recorded: 2019-11-11
Pages: 6
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Having Semiconductor Chip Between First and Second Redistribution Layers