Patent Assignment
Reel/Frame 050985/0312
Assignment of Assignor's Interest
Recorded: 2019-11-12
Pages: 7
Assignors
LEE, YOUNGKWAN
Executed: 2019-09-30
HUR, YOUNGSIK
Executed: 2019-10-10
HAN, TAEHEE
Executed: 2019-10-10
KIM, YONGHOON
Executed: 2019-10-08
LEE, YUNTAE
Executed: 2019-10-08
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Having a Redistribution Layer for Package-on-Package Structure