Patent Assignment
Reel/Frame 050985/0976
Assignment of Assignor's Interest
Recorded: 2019-11-12
Pages: 4
Assignors
HONDA, KAZUTAKA
Executed: 2018-05-21
CHABANA, KOICHI
Executed: 2018-05-29
ONO, KEISHI
Executed: 2018-06-01
NAGAI, AKIRA
Executed: 2018-05-31
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Adhesive for Semiconductor Device, and High Productivity Method for Manufacturing Said Device
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Feb 9, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062688/0345 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →