Patent Assignment
Reel/Frame 050987/0578
Assignment of Assignor's Interest
Recorded: 2019-11-12
Pages: 3
Assignor
HUANG, WEN HUNG
Executed: 2019-11-08
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Package Structures, Semiconductor Device Packages and Methods of Manufacturing the Same