Patent Assignment
Reel/Frame 050987/0768
Assignment of Assignor's Interest
Recorded: 2019-11-12
Pages: 6
Assignors
CHAOWASAKOO, TANAWAN
Executed: 2019-11-08
TAN, HUA HONG
Executed: 2019-11-08
LAYLO, ALEXANDER LUCERO
Executed: 2019-11-08
JAENGKRAJARNG, THANAWAT
Executed: 2019-11-08
Assignee
UTAC HEADQUARTERS PTE. LTD.
22 ANG MO KIO INDUSTRIAL PARK 2, SINGAPORE, 569506, SINGAPORE
Covered Property
(1)
Conductive Bonding Layer with Spacers Between a Package Substrate and Chip