Patent Assignment
Reel/Frame 050987/0969
Assignment of Assignor's Interest
Recorded: 2019-11-13
Pages: 5
Assignors
CHUANG, LIPU KRIS
Executed: 2019-10-21
TSAI, CHUNG-HAO
Executed: 2019-10-24
PAN, HSIN-YU
Executed: 2019-10-21
CHIANG, YI-CHE
Executed: 2019-10-21
LIN, CHIEN-CHANG
Executed: 2019-10-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Memory Module, Semiconductor Package Including the Same, and Manufacturing Method Thereof