Patent Assignment
Reel/Frame 050996/0725
Assignment of Assignor's Interest
Recorded: 2019-11-13
Pages: 5
Assignors
LIAO, WEI-HAO
Executed: 2019-10-01
TIEN, HSI-WEN
Executed: 2019-10-01
LU, CHIH WEI
Executed: 2019-10-01
DAI, PIN-REN
Executed: 2019-10-01
LEE, CHUNG-JU
Executed: 2019-10-02
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Methods of Etching Metals in Semiconductor Devices