Patent Assignment
Reel/Frame 051013/0068
Assignment of Assignor's Interest
Recorded: 2019-11-14
Pages: 3
Assignor
PAHL, WOLFGANG
Executed: 2019-10-25
Assignee
TDK CORPORATION
2-5-1, NIHONBASHI, CHUO-KU, TOKYO, 103-6128, JAPAN
Covered Property
(1)
Carrier Substrate for Stress Sensitive Device and Method of Manufacture
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.