Patent Assignment
Reel/Frame 051014/0551
Assignment of Assignor's Interest
Recorded: 2019-11-14
Pages: 12
Assignors
LI, YI
Executed: 2019-07-10
QIAN, ZHIGUO
Executed: 2019-07-12
RAMANATHAN, PRASAD
Executed: 2019-07-15
JAYARAMAN, SAIKUMAR
Executed: 2019-07-10
AYGUN, KEMAL
Executed: 2019-08-08
AMADOR, HECTOR
Executed: 2019-07-15
COLLINS, ANDREW
Executed: 2019-07-12
XIE, JIANYONG
Executed: 2019-07-12
TOMISHIMA, SHIGEKI
Executed: 2019-07-10
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Architecture and Processes to Enable High Capacity Memory Packages Through Memory Die Stacking