Patent Assignment
Reel/Frame 051017/0577
Assignment of Assignor's Interest
Recorded: 2019-11-15
Pages: 2
Assignor
TERAUCHI, IKUYA
Executed: 2019-11-14
Assignee
IBIDEN CO., LTD.
1, KANDACHO 2-CHOME, OGAKI, GIFU, 503-8604, JAPAN
Covered Property
(1)
Printed Wiring Board and Method for Manufacturing the Same