Patent Assignment
Reel/Frame 051020/0764
Assignment of Assignor's Interest
Recorded: 2019-11-15
Pages: 8
Assignors
SIGNORINI, GIANNI
Executed: 2019-03-27
SEIDEMANN, GEORG
Executed: 2019-03-26
WAIDHAS, BERND
Executed: 2019-03-26
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Method to Implement Wafer-Level Chip-Scale Packages with Grounded Conformal Shield