Patent Assignment
Reel/Frame 051025/0747
Assignment of Assignor's Interest
Recorded: 2019-11-15
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Methods of Forming Interconnect Structures in Semiconductor Fabrication