Patent Assignment
Reel/Frame 051030/0392
Assignment of Assignor's Interest
Recorded: 2019-11-14
Pages: 6
Assignors
LEE, CHANGBO
Executed: 2019-09-30
OH, JOONSEOK
Executed: 2019-09-30
PARK, BYUNGLYUL
Executed: 2019-09-30
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Fan-Out Semiconductor Package