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Patent Assignment
Reel/Frame 051041/0015

Assignment of Assignor's Interest

Recorded: 2019-11-18 Pages: 3
Assignor
MOTOMURA, DAISUKE
Executed: 2019-11-08
Assignee
DEXERIALS CORPORATION
GATE CITY OSAKI EAST TOWER 8F, 1-11-2, OSAKI, SHINAGAWA-KU, TOKYO, 141-0032, JAPAN
Covered Property (1)
Underfill Material, Underfill Film, and Method for Manufacturing Semiconductor Device Using Same
Application: 16/687,191 →
Publication: US 2020/0109292