Patent Assignment
Reel/Frame 051043/0484
Assignment of Assignor's Interest
Recorded: 2019-11-18
Pages: 4
Assignors
LIN, PU-JU
Executed: 2019-10-30
KO, CHENG-TA
Executed: 2019-10-30
TAIN, RA-MIN
Executed: 2019-11-05
TSENG, TZYY-JANG
Executed: 2019-11-06
Assignee
UNIMICRON TECHNOLOGY CORP.
NO.38, XINGBANG RD., KWEI-SAN INDUSTRIAL ZONE, TAOYUAN DIST.,, TAOYUAN CITY, 330, TAIWAN
Covered Property
(1)
Chip Package Structure and Manufacturing Method Thereof