Patent Assignment
Reel/Frame 051055/0422
Assignment of Assignor's Interest
Recorded: 2019-11-19
Pages: 4
Assignors
MANDALAPU, CHANDRASEKHAR
Executed: 2019-09-17
FOUNTAIN, GAIUS GILLMAN, JR.
Executed: 2019-09-18
GAO, GUILIAN
Executed: 2019-09-17
Assignee
INVENSAS BONDING TECHNOLOGIES, INC.
3025 ORCHARD PARKWAY, ATTN: PATENT DEPARTMENT, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Dbi to Si Bonding for Simplified Handle Wafer
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Change of Name
Nov 19, 2025
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Reel/Frame 073635/0465 →