Patent Assignment
Reel/Frame 073635/0465
Change of Name
Recorded: 2025-11-19
Pages: 5
Assignor
INVENSAS BONDING TECHNOLOGIES, INC.
Executed: 2022-08-15
Assignee
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties
(30)
Method to Achieve Ultra-High Chip-to-Chip Alignment Accuracy for Wafer-to-Wafer Bonding Process
Patent:
9,466,538 →
Application:
14/951,634 →
Wafer Scale Die Handling
Method of Detachable Direct Bonding at Low Temperatures
3D Ic Method and Device
Heterogeneous Annealing Method and Device
Heterogeneous Annealing Method and Device
Die tray with channels
Microelectronic Assembly from Processed Substrate
Processing Stacked Substrates
Multi-metal contact structure
Multi-Metal Contact Structure in Microelectronic Component
Die Processing
Die Processing
Die Processing
Die Processing
Seal for microelectronic assembly
Probe methodology for ultrafine pitch Interconnects
Probe Methodology for Ultrafine Pitch Interconnects
Processed stacked dies
Diffusion Barrier Collar for Interconnects
Direct-Bonded Optoelectronic Interconnect for High-Density Integrated Photonics
Selective Recess
Techniques for Processing Devices
Direct-Bonded Lamination for Improved Image Clarity in Optical Devices
Low Temperature Bonded Structures
Low Temperature Bonded Structures
Dbi to Si Bonding for Simplified Handle Wafer
Bonding Surfaces for Microelectronics
Interlayer Connection of Stacked Microelectronic Components
Molded Direct Bonded and Interconnected Stack
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 26, 2004
From: ENQUIST, PAUL M.; FOUNTAIN, JR., GAIUS GILLMAN; PETTEWAY, CARL TAKASHI
To: ZIPTRONIX, INC.
Reel/Frame 015609/0262 →
Assignment of Assignor's Interest
Jan 9, 2006
From: ENQUIST, PAUL M.; FOUNTAIN, GAIUS GILLMAN JR.; TONG, QIN-YI
To: ZIPTRONIX, INC.
Reel/Frame 017439/0071 →
Assignment of Assignor's Interest
Jun 6, 2006
From: TONG, QIN-YI; FOUNTAIN, GAIUS GILLMAN, JR.
To: ZIPTRONIX, INC.
Reel/Frame 017973/0776 →
Assignment of Assignor's Interest
Jan 15, 2014
From: ENQUIST, PAUL M.; FOUNTAIN, GAIUS GILLMAN, JR.
To: ZIPTRONIX, INC.
Reel/Frame 031974/0619 →
Assignment of Assignor's Interest
Dec 1, 2015
From: SKORDAS, SPYRIDON; LIN, WEI; LI, SHIDONG; IYER, SUBRAMANIAN S.
To: GLOBALFOUNDRIES INC.
Reel/Frame 037180/0812 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Change of Name
Jun 28, 2017
From: ZIPTRONIX , INC.
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 043029/0657 →
Assignment of Assignor's Interest
Nov 8, 2017
From: UZOH, CYPRIAN EMEKA
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 044072/0982 →
Assignment of Assignor's Interest
Dec 19, 2017
From: UZOH, CYPRIAN EMEKA; GAO, GUILIAN
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 044433/0823 →
Assignment of Assignor's Interest
Jul 24, 2018
From: KATKAR, RAJESH; WANG, LIANG; UZOH, CYPRIAN EMEKA; HUANG, SHAOWU
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 046444/0920 →
Assignment of Assignor's Interest
Jul 25, 2018
From: UZOH, CYPRIAN EMEKA
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 046455/0279 →
Assignment of Assignor's Interest
Aug 24, 2018
From: KATKAR, RAJESH; UZOH, CYPRIAN EMEKA
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 046699/0818 →
Assignment of Assignor's Interest
Sep 4, 2018
From: DELACRUZ, JAVIER A.; ENQUIST, PAUL M.; FOUNTAIN, GAIUS GILLMAN, JR.; MOHAMMED, ILYAS
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 046777/0618 →
Security Agreement
Nov 29, 2018
From: GLOBALFOUNDRIES INC.
To: WILMINGTON TRUST, NATIONAL ASSOCIATION
Reel/Frame 049490/0001 →
Assignment of Assignor's Interest
Feb 21, 2019
From: UZOH, CYPRIAN EMEKA
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 048401/0525 →
Assignment of Assignor's Interest
Nov 19, 2019
From: UZOH, CYPRIAN EMEKA
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 051055/0585 →
Assignment of Assignor's Interest
Jan 29, 2020
From: KATKAR, RAJESH; UZOH, CYPRIAN EMEKA
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 051658/0736 →
Assignment of Assignor's Interest
Apr 28, 2020
From: UZOH, CYPRIAN EMEKA; MIRKARIMI, LAURA WILLS
To: INVENSAS BONDING TECHONOLGIES, INC.
Reel/Frame 052516/0496 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →
Assignment of Assignor's Interest
Jun 24, 2020
From: UZOH, CYPRIAN EMEKA
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 053025/0395 →
Release of Security Interest
Jul 10, 2020
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES INC.
Reel/Frame 053178/0457 →
Assignment of Assignor's Interest
Jul 13, 2020
From: GLOBALFOUNDRIES INC.
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 053187/0970 →
Release of Security Interest
Nov 20, 2020
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES INC.
Reel/Frame 054636/0001 →
Security Interest
May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →