Interlayer connection of stacked microelectronic components
Representative techniques and devices including process steps may be employed to form a common interconnection of a multi-die or multi-wafer stack. Each device of the stack includes a conductive pad disposed at a predetermined relative position on a surface of the device. The devices are stacked to vertically align the conductive pads. A through-silicon via is formed that electrically couples the conductive pads of each device of the stack.
1. A method of forming a microelectronic assembly, comprising:
forming a conductive pad at a first relative position on a surface of each of a plurality of microelectronic substrates, the conductive pad on the surface of at least all but one of the plurality of microelectronic substrates including an interior area free of conductive material, the plurality of microelectronic substrates comprising at least three microelectronic substrates;
direct bonding the plurality of microelectronic substrates to form a vertical stack of microelectronic substrates while vertically aligning at least a portion of the conductive pad on the surface of each of the plurality of microelectronic substrates, including intentionally offsetting the conductive pad on the surface of each subsequent microelectronic substrate of the plurality of microelectronic substrates a predetermined distance relate to the conductive pad on the surface of a previously placed microelectronic substrate of the plurality of microelectronic substrates;
etching one or more layers of the at least all but one of the plurality of microelectronic substrates in the vertical stack of microelectronic substrates to form a cavity extending through the at least all but one of the plurality of microelectronic substrates, the cavity adjacent to a portion of the conductive pad on each of the microelectronic substrates and extending through the interior area of the conductive pad of the at least all but one of the plurality of microelectronic substrates; and
filling the cavity with a conductive material to form a through silicon via (TSV) common to each of the plurality of microelectronic substrates of the vertical stack of microelectronic substrates, the TSV comprising an interlayer connection electrically coupling the conductive pad on the surface of each of the plurality of microelectronic substrates.
2. The method of forming a microelectronic assembly of claim 1 , further comprising patterning an exterior perimeter of the conductive pad on the surface of each of the plurality of microelectronic substrates to have a first predetermined size and shape and patterning the interior portion of the conductive pad on the surface of the at least all but one of the microelectronic substrates to have a second predetermined size and shape.
3. The method of forming a microelectronic assembly of claim 2 , further comprising patterning the conductive pad on the surface of the at least all but one of the microelectronic substrates to have a “C,” a “D,” a “G,” or a “U” shape.
4. The method of forming a microelectronic assembly of claim 2 , wherein the second predetermined size and shape comprises a polygon, a geometric shape, an eccentric shape, an irregular shape, or a multi-faceted shape.
5. The method of forming a microelectronic assembly of claim 1 , wherein the number of iterative etching steps to form the cavity is reduced by forming the conductive pad on the surface of each of the plurality of microelectronic substrates to include the interior area.
6. The method of forming a microelectronic assembly of claim 1 , wherein a size of the interior area of the conductive pad on the surface of the at least all but one of the microelectronic substrates is not uniform throughout the microelectronic substrates.
7. The method of forming a microelectronic assembly of claim 6 , wherein a size of the interior area of the conductive pad on the surface of the at least all but one of the microelectronic substrates progressively increases with each of the microelectronic substrates of the stack, from a microelectronic substrate at a bottom of the stack to a microelectronic substrate at a top of the stack.
8. The method of forming a microelectronic assembly of claim 1 , wherein the intentionally offsetting each subsequent microelectronic substrate the predetermined distance is in a first offset direction relative to the previously placed microelectronic substrate.
9. The method of forming a microelectronic assembly of claim 8 , wherein the predetermined distance is larger than an average die placement error of die placement tools used to stack the plurality of microelectronic substrates to form the vertical stack.
10. The method of forming a microelectronic assembly of claim 1 , wherein the direct bonding the plurality of microelectronic substrates is carried out using an ambient temperature direct bonding technique without adhesives prior to forming the cavity.
11. A method of forming a microelectronic assembly, comprising:
forming a conductive pad at a first relative position on a surface of each of a plurality of microelectronic substrates, the conductive pad on the surface of each of the plurality of microelectronic substrates including an interior area free of conductive material, and the plurality comprising at least three microelectronic substrates;
stacking the plurality of microelectronic substrates to form a vertical stack of microelectronic substrates while vertically aligning at least a portion of the conductive pad on the surface of each of the plurality of microelectronic substrates, including intentionally offsetting the conductive pad on the surface of each subsequent microelectronic substrate of the plurality of microelectronic substrates a predetermined distance relative to the conductive pad on the surface of a previously placed microelectronic substrate of the plurality of microelectronic substrates;
etching one or more layers of at least all but one of the plurality of microelectronic substrates in the vertical stack of microelectronic substrates to form a cavity extending through at least all but one of the plurality of microelectronic substrates, the cavity adjacent to a portion of the conductive pad on the surface of the at least all but one of the plurality of microelectronic substrates and extending through the interior area of the conductive pad of the at least all but one of the plurality of microelectronic substrates; and
filling the cavity with a conductive material to form a through silicon via (TSV) common to each of the plurality of microelectronic substrates of the vertical stack of microelectronic substrates, the TSV comprising an interlayer connection electrically coupling the conductive pad on the surface of each of the plurality of microelectronic substrates.
12. The method of forming a microelectronic assembly of claim 11 , further comprising forming the interior area of the conductive pad of each microelectronic substrate of the stack to have a different maximum dimension.
13. The method of forming a microelectronic assembly of claim 11 , further comprising forming the interior area of the conductive pad of each subsequent microelectronic substrate of the plurality of microelectronic substrates of the stack to have a larger maximum dimension than a maximum dimension of the interior area of the conductive pad of a previously placed microelectronic substrate of the plurality of microelectronic substrates.
14. The method of forming a microelectronic assembly of claim 11 , further comprising forming the interior area of the conductive pad of each of the plurality of microelectronic substrate of the stack to have a predetermined size and shape comprising a polygon, a geometric shape, an eccentric shape, an irregular shape, or a multi-faceted shape.