IP Library Assignment 052516/0496
Patent Assignment
Reel/Frame 052516/0496

Assignment of Assignor's Interest

Recorded: 2020-04-28 Pages: 3
Assignors
UZOH, CYPRIAN EMEKA
Executed: 2017-12-20
MIRKARIMI, LAURA WILLS
Executed: 2017-12-20
Assignee
INVENSAS BONDING TECHONOLGIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Microelectronic Assembly from Processed Substrate
Application: 15/849,325 →
Publication: US 2018/0182666
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Change of Name Nov 19, 2025
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Reel/Frame 073635/0465 →