Wafer scale die handling
View Patent ↗A waffle pack device including a member having recesses in a surface of the member to accommodate die from at least one semiconductor wafer. The member is compatible with semiconductor wafer handling equipment and/or semiconductor wafer processing. Preferably, the member accommodates at least a majority of die from a semiconductor wafer. Further, one semiconductor device assembly method is provided which removes die from a singular waffle pack device, places die from the single waffle pack device on a semiconductor package to assemble from the placed die all die components required for an integrated circuit, and electrically interconnects the placed die in the semiconductor package to form the integrated circuit. Another semiconductor device assembly method is provided which removes die from at least one waffle pack device, places die from the at least one waffle pack device on a semiconductor package to assemble from the placed die device components required for an integrated circuit, and electrically interconnects the placed die in the semiconductor package to form the integrated circuit.
1. A waffle pack device, comprising: a member including,
recesses in a surface of said member,
said member comprising a material and at least one of a size and shape, compatible with semiconductor wafer processing,
wherein the recesses are configured to tilt die in the recesses about an axis normal to a face surface of the member.
2. The device of claim 1 , wherein the material is compatible with wet wafer processing.
3. The device of claim 1 , wherein the recesses are sized and shaped to hold semiconductor die.
4. The device of claim 1 , wherein a number of said recesses is sufficient to accommodate at least a majority of die from a semiconductor wafer.
5. The device of claim 4 , wherein said number is greater than 50.
6. The device of claim 4 , wherein said number is at least one thousand.
7. The device of claim 1 , wherein the recesses have lateral dimensions from 0.05 to 0.2 mm larger than lateral dimensions of die from a semiconductor wafer.
8. The device of claim 1 , wherein the recesses have a depth up to 0.2 of a millimeter smaller or greater than a thickness of die from a semiconductor wafer.
9. The device of claim 1 , wherein the recesses are configured to tilt the die toward a center-of-mass of the member.
10. The device of claim 9 , wherein a tilt of said die in the recesses has a radial component of the tilt, directed toward one of the center of mass and a geometric center of said member,
said tilt having a tangential component disposed in a plane of said die and directed perpendicular to a line from a center of the die to one of the center of mass and the geometric center,
said radial component being greater in magnitude than the tangential component of the tilt.
11. The device of claim 9 , wherein said recesses are configured to tilt each of a first plurality of said die disposed in a first section of said member with a first tilt, and tilt each of a second plurality of said die in a second section of said member with a second tilt different than said first tilt.
12. The device claim 9 , wherein said first and second sections are quadrants.
13. The device of claim 1 , wherein said member comprises at least one of a semiconductor, silicon oxide, silicon nitride, Al, Cu, W, and silicide.
14. A waffle pack device, comprising:
a member including,
recesses in a surface of said member,
said member comprising a material and at least one of a size and shape, compatible with semiconductor wafer processing,
wherein said recesses are configured to tilt a die disposed in the recesses, said tilt has a radial component directed toward one of the center of mass and a geometric center of said member
said tilt having a tangential component disposed in a plane of said die and directed perpendicular to a line from a center of the die to one of the center of mass and the geometric center,
said radial component being greater in magnitude than the tangential component of the tilt.
15. A waffle pack device, comprising:
a member including,
recesses in a surface of said member,
said member comprising a material and at least one of a size and shape, compatible with semiconductor wafer processing,
wherein the recesses comprise:
side walls;
a bottom surface connecting to said side walls; and
a ledge on a side of the bottom surface opposite a center of mass or center of the member.
16. A waffle pack device, comprising:
a member including,
recesses in a surface of said member,
said member comprising a material and at least one of a size and shape, compatible with semiconductor wafer processing; and
channels formed in said member.
17. The device of claim 16 , wherein the member comprises a circular-shaped member, and the channels are disposed radially across the circular-shaped member.
18. The device of claim 16 , wherein the member comprises a circular-shaped member, and the channels disposed on chords across the circular-shaped member.
19. The device of claim 16 , wherein the channels are disposed adjacent to a side wall of the recesses.
20. The device of claim 16 , wherein at least two of the channels connect to each of the recesses.
21. The device of claim 20 , wherein the at least two channels are disposed on opposite sides of the recesses.
22. The device of claim 16 , wherein the channels have a depth equal to or greater than a depth of the recesses.
23. A waffle pack device, comprising:
a member including,
recesses in a surface of said member,
said member comprising a material and at least one of a size and shape, compatible with semiconductor wafer processing,
a lid to cover said member, wherein the lid has a plurality of mating recesses.
24. The device of claim 23 , wherein the mating recesses of the lid correspond in position to the recesses in the member.
25. The device of claim 23 , wherein at least one of the plurality of mating recesses comprises:
side walls; and
a bottom surface having a curved portion connecting to one of said side walls.
26. The device of claim 23 , wherein said mating recesses are configured to hold a die in a position to avoid contact between a planar surface of the die and a bottom surface of said mating recesses.
27. The device of claim 23 , wherein the lid comprises a conduit connecting to the mating recesses.
28. A waffle pack device, comprising:
a member including,
recesses in a surface of said member,
said member comprising a material and at least one of a size and shape, compatible with semiconductor wafer processing,
wherein said member comprises a circular-shaped member.
29. The device of claim 28 , wherein the member comprises an aluminum disk.
30. The device of claim 28 , wherein the member comprises a silicon disk.
31. The device of claim 30 , wherein said member comprises a silicon wafer including at least one of silicon oxide, silicon nitride, Al, Cu, W, and silicide.
32. The device of claim 28 , wherein the member comprises a silicon-on-insulator structure.
33. The device of claim 32 , wherein the silicon-on-insulator structure comprises:
a first silicon member;
a silicon oxide layer in contact with the first silicon member; and
a second silicon member in contact with the silicon oxide layer and including said recesses.
34. The device of claim 33 , wherein said first silicon member comprises a silicon layer of a thickness of 0.5-1.0 mm, said silicon oxide layer has a thickness of 1-10 μm, and said second silicon member comprises a silicon wafer of a thickness of 50-500 μm.
35. The device of claim 28 , wherein said circular-shaped member comprises: a member having a diameter of 100 mm.
36. The device of claim 28 , wherein said circular-shaped member comprises: a member having a diameter of 200 mm.
37. The device of claim 28 , wherein said member is circular with a diameter of 300 mm.
38. The device of claim 28 , wherein a number of said recesses is sufficient to accommodate at least a majority of die from a semiconductor wafer.
39. The device of claim 38 , wherein said number is greater than 50.
40. The device of claim 38 , wherein said number is at least one thousand.
41. A waffle pack device, comprising:
a circular-shaped member being compatible with semiconductor wafer processing; and
recesses in a surface of said member.
42. The device of claim 41 , wherein said circular-shaped member has a diameter of 100 mm.
43. The device of claim 41 , wherein said circular-shaped member has a diameter of 200 mm.
44. The device of claim 41 , wherein said circular-shaped member has a diameter of 300 mm.
45. The device of claim 41 , wherein a number of said recesses is sufficient to accommodate at least a majority of die from a semiconductor wafer.
46. The device of claim 45 , wherein said number is greater than 50.
47. The device of claim 45 , wherein said number is at least one thousand.
48. A waffle pack device, comprising:
a member including,
recesses in a surface of said member,
said recesses configured to tilt die from a semiconductor wafer about an axis normal to a face surface of the member.
49. The device of claim 48 , wherein the recesses are configured to tilt die placed in the recesses toward a center-of-mass of the member.
50. The device of claim 48 , wherein said recesses are configured to tilt a die disposed in the recesses, said tilt has a radial component directed toward one of the center of mass and a geometric center of said member,
said tilt having a tangential component disposed in a plane of said die and directed perpendicular to a line from a center of the die to one of the center of mass and the geometric center,
said radial component being greater in magnitude than the tangential component of the tilt.
51. The device of claim 48 , wherein a number of said recesses is sufficient to accommodate at least a majority of die from a semiconductor wafer.
52. The device of claim 51 , wherein said number is greater than 50.
53. The device of claim 51 , wherein said number is at least one thousand.
54. An apparatus for holding semiconductor die, comprising:
a carrier having recesses to accommodate said die; and
means for securing said die during rotation of said carrier such that said die are not expelled during said rotation located in said recesses,
wherein said means for securing comprises means for tilting said die in said recesses.
55. The apparatus of claim 54 , wherein the means for tilting is configured to tilt the die toward a center-of-mass of the carrier.
56. The device of claim 54 , wherein said recesses are configured to tilt a die disposed in the recesses, said tilt has a radial component directed toward one of the center of mass and a geometric center of said member,
said tilt having a tangential component disposed in a plane of said die and directed perpendicular to a line from a center of the die to one of the center of mass and the geometric center,
said radial component being greater in magnitude than the tangential component of the tilt.
57. The apparatus of claim 54 , wherein said carrier is configured to be compatible with a semiconductor wafer processing tool, and
means for securing comprises a cover to secure said die in said carrier during said rotation of the carrier by said semiconductor processing tool.