Patent Assignment
Reel/Frame 051057/0668
Assignment of Assignor's Interest
Recorded: 2019-11-19
Pages: 6
Assignors
LIM, JUN YOUNG
Executed: 2019-11-08
PARK, JONG SEOK
Executed: 2019-11-07
YOON, HYUNG KYU
Executed: 2019-11-08
IM, SEONG HWAN
Executed: 2019-11-08
YANG, GI UK
Executed: 2019-11-08
YOO, DAE SUNG
Executed: 2019-11-08
Assignee
LG INNOTEK CO., LTD.
98, HUAM-RO, JUNG-GU, SEOUL, 04637, KOREA, REPUBLIC OF
Covered Property
(1)
Flexible Circuit Board for All-in-One Chip on Film, Chip Package Including Same, and Electronic Device Including Same