Patent Assignment
Reel/Frame 051065/0433
Assignment of Assignor's Interest
Recorded: 2019-11-20
Pages: 4
Assignors
PON, FLORENCE
Executed: 2019-04-23
XU, YI
Executed: 2019-04-23
ZHANG, JAMES
Executed: 2019-04-23
CAI, YUHONG
Executed: 2019-04-23
LEUTEN, TYLER
Executed: 2019-04-23
GLENNAN, WILLIAM
Executed: 2019-04-23
KIM, HYOUNG IL
Executed: 2019-04-23
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Die Over Mold Stacked Semiconductor Package
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.