IP Library Assignment 072850/0914
Patent Assignment
Reel/Frame 072850/0914

Assignment of Assignor's Interest

Recorded: 2025-09-17 Pages: 70
Assignor
INTEL CORPORATION
Executed: 2025-08-19
Assignee
SK HYNIX NAND PRODUCT SOLUTIONS CORP. (DBA SOLIDIGM)
10951 WHITE ROCK ROAD, RANCHO CORDOVA, CALIFORNIA, 95670
Covered Properties (25)
Active Extensible Memory Hub
Application: 16/191,555 →
Publication: US 2019/0087374
Data Portion Allocation for Temperature Management of Memory Devices
Application: 16/219,365 →
Publication: US 2019/0114107
Concept for Approximate Deduplication in Storage and Memory
Application: 16/221,832 →
Publication: US 2019/0121564
Minimal Aliasing Bit-Error Correction Code
Application: 16/236,151 →
Publication: US 2020/0210284
Capacitance Reduction for Semiconductor Devices Based on Wafer Bonding
Application: 16/358,520 →
Publication: US 2020/0303238
Technologies to Address Individual Bits in Memory
Application: 16/367,321 →
Publication: US 2019/0220400
Mfm Capacitor with Multilayered Oxides and Metals and Processes for Forming Such
Application: 16/368,450 →
Publication: US 2020/0312949
Mfm Capacitor and Process for Forming Such
Application: 16/369,737 →
Publication: US 2020/0312950
Apparatus for Memory Built-in Self-Test with Error Detection and Correction Code Awareness
Application: 16/370,993 →
Publication: US 2019/0227121
Technologies for Providing Multiple Levels of Error Correction
Application: 16/375,362 →
Publication: US 2019/0227871
Metal Oxycarbide Resists as Leave Behind Plugs
Application: 16/389,672 →
Publication: US 2020/0335434
Charge-Induced Threshold Voltage Tuning in Iii-N Transistors
Application: 16/390,819 →
Publication: US 2020/0335590
Die Over Mold Stacked Semiconductor Package
Application: 16/392,295 →
Publication: US 2020/0343221
Hybrid Directory and Snoopy-Based Coherency to Reduce Directory Update Overhead in Two-Level Memory
Application: 16/405,691 →
Publication: US 2020/0356482
Data Transfer Method and Apparatus for Differential Data Granularities
Application: 16/422,827 →
Publication: US 2019/0278513
Lids for Integrated Circuit Packages with Solder Thermal Interface Materials
Application: 16/435,355 →
Publication: US 2020/0388554
Vertical Thin Film Transistor Structures with Localized Gate Dielectric
Application: 16/435,359 →
Publication: US 2020/0388711
Channeled Lids for Integrated Circuit Packages
Application: 16/437,872 →
Publication: US 2020/0395269
Trench Capacitor with Extended Dielectric Layer
Application: 16/441,905 →
Publication: US 2020/0395435
Technologies for Preserving Error Correction Capability in Compute-in-Memory Operations
Application: 16/448,126 →
Publication: US 2019/0303237
Adaptive Processor Resource Utilization
Application: 16/825,538 →
Publication: US 2020/0218676
Memory Structures Having Improved Write Endurance
Application: 16/895,555 →
Publication: US 2020/0303642
Fabricating an Rf Filter on a Semiconductor Package Using Selective Seeding
Application: 17/344,715 →
Publication: US 2021/0305668
Multi-Mode Protected Memory
Application: 17/441,214 →
Publication: US 2022/0164293
Technologies for Preserving Error Correction Capability in Compute-in-Memory Operations
Application: 17/530,281 →
Publication: US 2022/0075684
Related Assignments (18)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 15, 2018
From: KHAN, JAWAD; GRIMSRUD, KNUT
To: INTEL CORPORATION
Reel/Frame 047512/0411 →
Assignment of Assignor's Interest Dec 13, 2018
From: GWIN, PAUL J.; ALLURI, PRASAD
To: INTEL CORPORATION
Reel/Frame 047770/0761 →
Assignment of Assignor's Interest Apr 1, 2019
From: KHAN, JAWAD B.; COULSON, RICHARD
To: INTEL CORPORATION
Reel/Frame 048756/0824 →
Assignment of Assignor's Interest Apr 5, 2019
From: WU, WEI; SUNDARAM, RAJESH; CHAUHAN, CHETAN; KHAN, JAWAD B.
To: INTEL CORPORATION
Reel/Frame 048803/0607 →
Assignment of Assignor's Interest Apr 5, 2019
From: KUMAR, KARTHIK; GUIM BERNAT, FRANCESC; HAJEER, MUSTAFA; WILLHALM, THOMAS
To: INTEL CORPORATION
Reel/Frame 048801/0814 →
Assignment of Assignor's Interest Apr 23, 2019
From: NIDHI, NIDHI; RADOSAVLJEVIC, MARKO; DASGUPTA, SANSAPTAK; CAO, YANG
To: INTEL CORPORATION
Reel/Frame 048974/0723 →
Assignment of Assignor's Interest May 7, 2019
From: GEETHA, VEDARAMAN; BAXTER, JEFFREY; MURALIDHARA, SAI PRASHANTH; VENKATESWARAN, SHARADA
To: INTEL CORPORATION
Reel/Frame 049105/0595 →
Assignment of Assignor's Interest May 21, 2019
From: AZAM, ASAD; GOPAL, R SELVAKUMAR RAJA; CHEN, KAITLYN
To: INTEL CORPORATION
Reel/Frame 049244/0407 →
Assignment of Assignor's Interest Jun 19, 2019
From: HARATIPOUR, NAZILA; LIN, CHIA-CHING; CHANG, SOU-CHI; YOUNG, IAN A.
To: INTEL CORPORATION
Reel/Frame 049512/0879 →
Assignment of Assignor's Interest Jul 24, 2019
From: VENKATRAMAN, SHRINIVAS; OOI, ENG HUN; KHALILI, SAHAR; PATEL, DIMPESH
To: INTEL CORPORATION
Reel/Frame 049852/0819 →
Assignment of Assignor's Interest Nov 19, 2019
From: MANNEBACH, EHREN; LILAK, AARON; MEHANDRU, RISHABH; YOO, HUI JAE
To: INTEL CORPORATION
Reel/Frame 051056/0245 →
Assignment of Assignor's Interest Nov 20, 2019
From: KRYSAK, MARIE; LIN, KEVIN L.; BRISTOL, ROBERT; WALLACE, CHARLES H.
To: INTEL CORPORATION
Reel/Frame 051069/0202 →
Assignment of Assignor's Interest Nov 20, 2019
From: PON, FLORENCE; XU, YI; ZHANG, JAMES; CAI, YUHONG
To: INTEL CORPORATION
Reel/Frame 051065/0433 →
Assignment of Assignor's Interest Nov 25, 2019
From: DOYLE, BRIAN; HOURANI, RAMI; KARPOV, ELIJAH; MAJHI, PRASHANT
To: INTEL CORPORATION
Reel/Frame 051109/0717 →
Assignment of Assignor's Interest Nov 26, 2019
From: FALOLA, BAMIDELE DANIEL; DAS MAHAPATRA, SUSMRITI; CHAN ARGUEDAS, SERGIO ANTONIO; LI, PENG
To: INTEL CORPORATION
Reel/Frame 051120/0396 →
Assignment of Assignor's Interest Jan 13, 2020
From: HARATIPOUR, NAZILA; LIN, CHIA-CHING; CHANG, SOU-CHI; PENUMATCHA, ASHISH VERMA
To: INTEL CORPORATION
Reel/Frame 051491/0958 →
Assignment of Assignor's Interest Jan 13, 2020
From: HARATIPOUR, NAZILA; LIN, CHIA-CHING; CHANG, SOU-CHI; PENUMATCHA, ASHISH VERMA
To: INTEL CORPORATION
Reel/Frame 051573/0816 →
Assignment of Assignor's Interest Mar 4, 2020
From: KOZHIKKOTTU, VIVEK; SOMASEKHAR, DINESH; WU, WEI; RAMASUBRAMANIAN, SHANKAR GANESH
To: INTEL CORPORATION
Reel/Frame 052014/0531 →