Patent Assignment
Reel/Frame 051056/0245
Assignment of Assignor's Interest
Recorded: 2019-11-19
Pages: 4
Assignors
MANNEBACH, EHREN
Executed: 2019-03-14
LILAK, AARON
Executed: 2019-03-14
MEHANDRU, RISHABH
Executed: 2019-03-14
YOO, HUI JAE
Executed: 2019-03-14
MORROW, PATRICK
Executed: 2019-03-14
LIN, KEVIN
Executed: 2019-03-14
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Capacitance Reduction for Semiconductor Devices Based on Wafer Bonding
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.