Patent Assignment
Reel/Frame 051120/0396
Assignment of Assignor's Interest
Recorded: 2019-11-26
Pages: 8
Assignors
FALOLA, BAMIDELE DANIEL
Executed: 2019-05-28
DAS MAHAPATRA, SUSMRITI
Executed: 2019-05-30
CHAN ARGUEDAS, SERGIO ANTONIO
Executed: 2019-11-26
LI, PENG
Executed: 2019-08-20
SAHA, AMITESH
Executed: 2019-05-30
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Lids for Integrated Circuit Packages with Solder Thermal Interface Materials
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.