Patent Assignment
Reel/Frame 051069/0073
Assignment of Assignor's Interest
Recorded: 2019-11-20
Pages: 5
Assignors
SUN ZHOU, XIAO DI
Executed: 2019-04-08
MALLIK, DEBENDRA
Executed: 2019-04-09
GUO, XIAOYING
Executed: 2019-04-08
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Coreless Architecture and Processing Strategy for Emib-Based Substrates with High Accuracy and High Density